Micro and Nano Fabrication Facility

Overview of Services

The Tufts Micro and Nano Fabrication Facility is a 1000 sq. ft. Class 1000 cleanroom located at 200 Boston Avenue, in Medford. We have been providing micro and nano fabrication and metrology capabilities to the Tufts community since 2007.   The lab has contact photolithography capabilities (spin, bake, expose, develop) , ebeam lithography (in a Tescan Vega SEM), PVD thin film deposition (DC & RF sputtering, including reactive sputtering, and thermal evaporation), Atomic Layer Deposition (ALD), Rapid Thermal Processing (RTP), Parylene coating, O2/SF6/CF4 plasma processing, dicing, wirebonding, and a variety of wet chemical processing capabilities.  For Metrology we have DekTak stylus profilometry, Zygo NewView white light interferometry, Vega Tungsten SEM with SE and BSE, UV-VIS reflectometer, 4-point probe, and inspection microscopes.

Our mission is to provide micro- and nano-manufacturing and associated metrology capabilities to Tufts students and faculty, as well as the broader technical community in Boston Metro West, to enable world class research and relevant, compelling teaching.

Leadership

Prof. Robert White | Faculty Advisor

Dr. James Vlahakis | Lab Director

Ms. Stacie Simon | Lab Coordinator

Location and hours of operation

Hours Location

Lab available 24/7/365 to users      

 

 

Rooms 2713-2715

200 Boston Ave
Medford, MA 02155

Links and Resources

Contacts

Name Role Phone Email Location
Jim Vlahakis
Lab Director
 
617-627-5155
 
james.vlahakis@tufts.edu
 
200 Boston Ave
 
Rob White
Faculty Advisor
 
617-627-2210
 
r.white@tufts.edu
 
200 Boston Ave
 
Stacie Simon
Lab Coordinator
 
617-627-0900
 
stacie.simon@tufts.edu
 
200 Boston Ave
 
Lenny Paritsky
Sr Research Tech Spec/IT point person
 
617-627-4415
 
lenny.paritsky@tufts.edu
 
126-128 Curtis St
 
Frank Straceski
Student Microfabrication Technician
 

 
francis.straceski@tufts.edu
 

 
Mischael Anilus
Student Microfabrication Technician
 

 
mischael.anilus@tufts.edu
 

 
Spencer Schmid
Student Microfabrication Technician
 

 
edward.schmid@tufts.edu
 

 

Service list


Search available services:
Name Description Price
Angstrom Engineering DC/RF Sputtering

Sputter deposition of thin films of molybdenum, aluminum, silicon dioxide, or aluminum nitride via DC or RF sputtering or reactive sputtering.  Substrates are 100 mm diameter or smaller pieces.  A heated substrate holder is available with 300C maximum temperature.  Users should specify desired film thickness, temperature, dep rate, or can ask the lab to recommend a typical process.  Wafers should be clean and particle free.  Allowed materials in the tool include silicon, silicon nitride, silicon dioxide, aluminum, aluminum nitride, aluminum oxide, molybdenum, DQN (S1800, SPR) and AZ photoresists.  Additional materials may be allowed, please ask.

Internal Academic $120.00 wafer
External Non Academic $300.00 wafer
External Academic $156.00 wafer
Electroplating

Copper and nickel electroplating services are available.  Copper is a bright acid copper (copper sulfate) chemistry.  Nickel is a low-stress Nickel Sulfamate chemistry.  Both chemistries are from Technic.  Plating will be conducted on 100 mm diameter wafers or smaller pieces.  Customer must supply substrates with seed layer (evaporated or sputtered Ti/Cu recommended).  Maximum thickness 10 microns.

Inquire
Parylene Coating

Parylene coating services using Parylene-C are available in a PDS-2010 Labcoater system.  Available thicknesses are from 0.5 microns to 20 microns.  Maximum substrate size is 150 mm.  At most 3 substrates can be loaded simultaneously. Deposition is conformal.  Substrate will experience elevated temperatures (~135 C) and low pressures (~ 10 mTorr) during deposition.  Substrate must be clean and free of particles.

Inquire